| 摘要 |
Provided is a noncontact IC card wherein an electrostatic discharge failure of an IC chip embedded in the IC card is eliminated. In the noncontact IC card, at least a magnetic recording layer, a metal reflecting layer and a hologram layer are successively laminated on a card base material, and an antenna and an IC chip connected with the antenna are embedded in the card base material. The noncontact IC card is characterized in that the metal reflecting layer is composed of a material having an electrical conductivity lower than 28.9x10^6 S/m or a thin film having a surface resistivity of 7.02 ohms/cm or more.
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