| 摘要 |
In a vacuum transfer chamber (10), a position detecting mechanism (33) for detecting the positions of semiconductor wafers (W) is arranged. The semiconductor wafers (W) arranged at prescribed positions in a load lock chamber (17) and vacuum processing chambers (11-16) are transferred to the position detecting mechanism (33) by a vacuum transfer mechanism (30) and the positions of the wafers are detected. Then, based on the detection results, aligning between the load lock chamber (17) and the vacuum processing chambers (11-16) is performed.
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