发明名称 ELECTROMAGNETIC BANDGAP STRUCTURE AND PRINTED CIRCUIT BOARD
摘要 <p>An electromagnetic band gap structure and a printed circuit board are provided to prevent a mixed signal in an electronic device having an RF circuit and a digital circuit on the same substrate. An electromagnetic band gap structure includes first to third metal layers(210-1,210-2,210-3), first to third dielectric layers(220a,220b,220c), a metal plate(330), and first and second vias(340,360). The first dielectric layer is formed on the first metal layer. The second metal layer is formed on the first dielectric layer and has a hole(350). The second dielectric layer is formed on the second metal layer. The metal plate is formed on the second dielectric layer. The first via connects the first metal layer and the metal plate through the hole. The third dielectric layer is formed on the metal plate and the second dielectric layer. The third metal layer is formed on the third dielectric layer. The second via connects the metal layer and the third metal layer.</p>
申请公布号 KR100851065(B1) 申请公布日期 2008.08.12
申请号 KR20070041993 申请日期 2007.04.30
申请人 SAMSUNG ELECTRO-MECHANICS CO., LTD. 发明人 PARK, DAE HYUN;KIM, HAN;HAN, MI JA;KOO, JA BU
分类号 H05K1/02 主分类号 H05K1/02
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