摘要 |
A probe head and a manufacturing method thereof are provided to improve thickness uniformity of a cylindrical probe tip and a curved micro-spring. A probe head includes a cylindrical probe tip(1), a curved micro-spring(2) having one end connected to the probe tip, and a bumper(3) bonded with a pad(4) of a space transformer(5). The bumper is formed at the other end of the curved micro-spring. A manufacturing method of the probe head includes a process for forming a through-hole in active silicon of an insulator substrate including carrier silicon, a barrier oxide layer, and the active silicon, a process for forming a slope on the carrier silicon, a process for forming a probe tip in the through-hole of the active silicon, a process for forming the curved micro-spring, and a process for forming the bumper, a process for bonding the bumper with the pad, and a process for removing the silicon on insulator.
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