发明名称 |
BONDING HEAD FOR BONDING MACHINE |
摘要 |
A chip transfer head of bonding equipment is provided to minimize loss of a chip in a process for transferring the chip to a bonding head by preventing a breakdown of a chip buffer. A driving unit is installed in a unit body(91). A fixing body(110) is fixed to the driving unit and is rotated by using the driving force of the driving unit. A head(150) is movably coupled with the fixing body and is rotated around the fixing body according to the rotation of the fixing body to absorb a chip from a lower side and to transfer the chip to an upper side. A head pulling unit pulls the head from the lower side to reduce a contact shock between the head and the chip. A head supporting unit is connected to the head and the fixing body to support elastically the head.
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申请公布号 |
KR100851567(B1) |
申请公布日期 |
2008.08.12 |
申请号 |
KR20070032933 |
申请日期 |
2007.04.03 |
申请人 |
TOP ENGINEERING CO., LTD. |
发明人 |
CHOI, HAN HYOUN |
分类号 |
H01L21/48 |
主分类号 |
H01L21/48 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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