发明名称 |
Staggered wirebonding configuration |
摘要 |
The present invention discloses a staggered finger configuration comprising a plurality of first and second conducting wires alternately arranged on the substrate, wherein each of the first conducting wire connecting an inner and an outer fingers and each of the second conducting wire connecting an intermediate finger between the inner and the outer fingers, thereby forming a staggered configuration.
|
申请公布号 |
US7411287(B2) |
申请公布日期 |
2008.08.12 |
申请号 |
US20050265085 |
申请日期 |
2005.11.03 |
申请人 |
ADVANCED SEMICONDUCTOR ENGINEERING, INC. |
发明人 |
DING YI-CHUAN |
分类号 |
H01L23/48;H01L21/56;H01L21/607;H01L23/04;H01L23/485;H01L23/498 |
主分类号 |
H01L23/48 |
代理机构 |
|
代理人 |
|
主权项 |
|
地址 |
|