发明名称 |
Leadless plastic chip carrier and method of fabricating same |
摘要 |
A process for fabricating a leadless plastic chip carrier includes providing a leadframe including a plurality of contacts circumscribing a void; fixing a heat sink to the contacts of the leadframe using an intermediate non-electrically conductive adhesive such that the heat sink spans the void; mounting a semiconductor die to the heat sink in the void; wire bonding ones of the contacts to the pads of the semiconductor die; encapsulating the semiconductor die and the wire bonds in a molding material and singulating the leadless plastic chip carrier.
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申请公布号 |
US7410830(B1) |
申请公布日期 |
2008.08.12 |
申请号 |
US20050234963 |
申请日期 |
2005.09.26 |
申请人 |
ASAT LTD |
发明人 |
FAN CHUN HO;LIN TSUI YEE;LAU PING SHEUNG |
分类号 |
H01L21/00 |
主分类号 |
H01L21/00 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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