| 摘要 |
An image sensor and a manufacturing method thereof are provided to form a photodiode on a concave Si substrate by using a CMP(Chemical Mechanical Polishing) dishing effect. A concave surface(C) is formed on a substrate(110). A photodiode(130) is formed on the substrate including the concave surface. A microlens(150) is formed on the photodiode. In the process for forming the concave surface on the substrate, a trench is formed on the substrate. A CMP process is performed to planarize the substrate and to form the concave surface. In the process for forming the trench, a corner-rounded trench is formed by wet-etching the substrate.
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