发明名称 STACKED MICROELECTRONIC PACKAGES
摘要 A microelectronic assembly including a first and second microelectronic elements. (12, 14) Each of the microelectronic elements (12, 14) have oppositely-facing first (14, 22) and second surfaces (18, 24) and edges bounding the surfaces. The first microelectronic element (12) is disposed on the second microelectronic element (14) with the second surface (18) of the first microelectronic element (14) facing toward the first surface (22) of the second microelectronic element (14). The first microelectronic element (12) preferably extends beyond at least one edge of the second microelectronic element (14) and the second microelectronic element (14) preferably extends beyond at least one edge of the first microelectronic element (12).
申请公布号 KR20080073739(A) 申请公布日期 2008.08.11
申请号 KR20087013790 申请日期 2006.11.30
申请人 TESSERA INC. 发明人 MOHAMMED ILYAS;HABA BELGACEM
分类号 H01L23/12;H01L25/10 主分类号 H01L23/12
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