PRINTED CIRCUIT BOARD AND SEMICONDUCTOR MEMORY MODULE USING THE SAME

摘要

A printed circuit board and a semiconductor memory module using the same are provided to effectively radiate heat from the semiconductor memory module to the outside by applying a PCB(Printed Circuit Board) with a metal core on the semiconductor memory module. A printed circuit board includes a board unit(110) and a metal core(130). The board unit includes first and second surfaces, which are opposed to each other. The metal core includes an insertion portion(130i) and an elongation portion(130e). The insertion portion is inserted into an inner portion of the board unit. The elongation portion is elongated from at least one side portion of the board unit. The elongation portions of a pair of metal cores are elongated from both sides of the board unit, respectively. The metal core contains a thermally conductive material, which is selected from the group consisting of aluminum, copper, silver, and gold.