| 摘要 |
FIELD: electricity. ^ SUBSTANCE: invention relates to electric engineering and, particularly to the technology of hybrid chip cards production and may be used in radio electronics, instrument engineering and computer engineering. According to the invention process jumpers are produced from conducting layer of multilayer structure and conductor patterns are made on the work piece. Patterns are the result of photolithographic treatment and preferential etching of conducting and resisting layers between conductors and film-type jumpers. Following electrolytic precipitation of additional conducting and protective layer of conductor, preferential chemical etching of film-type jumpers is performed. Three-layer coating is laid on support. The said coating is comprised of an adhesive layer and conducting and protective layers. Photo resistant coating is applied on the last, i.e. protective layer repeating conductor pattern with process jumpers and stripes. The photo resistant coating is applied at least at one side the work piece perimeter. Then resistant coating is removed between stripes, and preferential chemical etching of conducting and resistant layer is performed. As a result conductors and stripes patterns are left on the work piece, which are interconnected with film-type process jumpers. Three-layer coating of the support is performed by consistent spraying of vanadium, copper and chrome layers under vacuum conditions. Electrolytic buildup of copper layer on conductors to the sizes of nominal thickness is conducted as soon as the resist material is removed from the conductor, stripes and film-type jumper surfaces. The jumper surfaces are recovered with photo resistant materials, whereas preferential chemical etching is performed for chrome protection layer. After that d.c. electrode adjoins the strips linked with the copper layer of conductors by means of film-type jumpers. The electrode helps to precipitate copper electrolyte ions until copper layer with nominal thickness is formed on the conductors. Electrolytic cushion layer of nickel precipitates on the conductors with nominal copper layer. Protective gold layer precipitates above copper layer. Then preferential chemical etching of the film-type jumpers and strips is performed producing hybrid chip card at the end. ^ EFFECT: improvement of hybrid chip cards quality and reduction of labour output ratio during their production. ^ 3 cl, 6 dwg |
