| 摘要 |
A polishing head of a chemical and mechanical polishing apparatus is provided to prevent stainless steel parts from being worn by placing an anti-abrasion member between a housing and a carrier and a retainer ring which is in friction contact with the housing and the carrier. A polishing head of a chemical and mechanical polishing apparatus includes a housing(110), a carrier(120), a wafer chuck(130), a retainer ring(140), a plurality of fastening members(150), and an anti-abrasion member(160). The housing defines an air path for guiding the inflow and discharge of the air. The carrier is coupled to the housing in such a way as to move up and down over the housing. The wafer chuck is provided with a plurality of through holes(114a,114b,114c) which communicate with the air path to suck a wafer using vacuum pressure applied through the air path, and is mounted to the carrier. The retainer ring is arranged along the edge of the carrier, is in contact with the polishing pad, and functions to retain the wafer held by the wafer chuck. The fastening members are fastened to the retainer ring through the carrier so as to mount the retainer ring to the edge of the carrier. The anti-abrasion member is arranged between the carrier and the retainer ring to prevent the abrasion of the retainer ring. |
