| 摘要 |
A method of LED packaging on transparent on transparent flexible film by: depositing transparent ITO on a flexible transparent substrate to form a conducting layer, and then processing the conducting layer to form a circuit pattern, and then bonding LED chips to the circuit pattern, and then molding a lens over the LED chips to form 360° wide view angle LED package. The method has considered voltage and current matching and provides a suitable wire bond function zone for the LED chips, and keeps the gold wires well protected.
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