发明名称 Method and System For Wafer Inspection
摘要 A method for inspecting semiconductor wafers patterned by a photomask includes loading a first wafer and scanning a first image of the first wafer, loading a second wafer and scanning a second image of the second wafer, comparing the first and second images, and classifying a difference detected between the first and second images as a potential defect on the photomask. The potential defect includes a haze defect on the photomask.
申请公布号 US2008187842(A1) 申请公布日期 2008.08.07
申请号 US20070671772 申请日期 2007.02.06
申请人 TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD. 发明人 HUNG CHANG-CHENG;GAU TSAI-SHENG
分类号 G03F7/004;G06K9/68 主分类号 G03F7/004
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