发明名称 |
Method and System For Wafer Inspection |
摘要 |
A method for inspecting semiconductor wafers patterned by a photomask includes loading a first wafer and scanning a first image of the first wafer, loading a second wafer and scanning a second image of the second wafer, comparing the first and second images, and classifying a difference detected between the first and second images as a potential defect on the photomask. The potential defect includes a haze defect on the photomask.
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申请公布号 |
US2008187842(A1) |
申请公布日期 |
2008.08.07 |
申请号 |
US20070671772 |
申请日期 |
2007.02.06 |
申请人 |
TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD. |
发明人 |
HUNG CHANG-CHENG;GAU TSAI-SHENG |
分类号 |
G03F7/004;G06K9/68 |
主分类号 |
G03F7/004 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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