发明名称 |
HIGH THROUGHPUT SERIAL WAFER HANDLING END STATION |
摘要 |
An ion implantation apparatus, system, and method are provided for transferring a plurality of workpieces between vacuum and atmospheric pressures, wherein an alignment mechanism is operable to align a plurality of workpieces for generally simultaneous transportation to a dual-workpiece load lock chamber. The alignment mechanism comprises a characterization device, an elevator, and two vertically-aligned workpiece supports for supporting two workpieces. First and second atmospheric robots are configured to generally simultaneously transfer two workpieces at a time between load lock modules, the alignment mechanism, and a FOUP. Third and fourth vacuum robots are configured to transfer one workpiece at a time between the load lock modules and a process module. |
申请公布号 |
WO2008070003(A3) |
申请公布日期 |
2008.08.07 |
申请号 |
WO2007US24698 |
申请日期 |
2007.11.30 |
申请人 |
AXCELIS TECHNOLOGIES, INC.;FERRARA, JOSEPH;MITCHELL, ROBERT |
发明人 |
FERRARA, JOSEPH;MITCHELL, ROBERT |
分类号 |
H01L21/00;H01L21/677 |
主分类号 |
H01L21/00 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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