| 摘要 |
A thermal bonding device is provided to assemble two products, which are injection-molded, through thermal bonding. A thermal bonding device includes a housing(11), a thermal bonding tip(12), a heat supplying member(13), a plurality of cooling nozzles(15), and a stopper member(16). The housing is fixed to an upper plate(5). The thermal bonding tip is coupled to a front end of the housing so that the thermal bonding is provided toward a lower jig(3). The heat supplying member is provided in the housing in order to supply heat to the thermal bonding tip. The cooling nozzles are provided toward the thermal bonding tip. The stopper member has one end press-fitted into an outer surface of the housing so that the thermal bonding tip and the cooling nozzle are positioned in a through hole(16a).
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