| 摘要 |
<p><P>PROBLEM TO BE SOLVED: To provide a low-cost solder-plated wire for a solar cell that has a strength lower by 0.2% as compared with a conventional solder-plated wire for a solar cell with tough-pitch copper (TPC) as a conductive material and has 0.2% strength equal to or lower than that of the conventional solder-plated wire for a solar cell with oxygen-free copper (OFC) as a conductor material, to provide a method of manufacturing the solder-plated wire for a solar cell, and to provide the solar cell. <P>SOLUTION: In the solder-plated wire 2 for a solar cell, the surface of a conductor 3 of which a section is formed in a flat-square shape is covered with solder plating 4 partially or wholly for joint to the solar cell 1. In this case, the conductor 3 is made of copper, and a copper material that is an inevitable impurity. The copper contains a sulfur affinity metal of one kind or not less than one kind selected from Nb, Ti, Zr, V, Ta, Fe, Ca, Mg, or Ni and has oxygen content exceeding 10 massppm at the remaining section. <P>COPYRIGHT: (C)2008,JPO&INPIT</p> |
