| 摘要 |
<p><P>PROBLEM TO BE SOLVED: To improve the productivity of a semiconductor device in a cut-bend step for an outer lead and a heat radiating fin, in a semiconductor device that is provided with a die pad for mounting a semiconductor chip, heat radiating fins that are extended outward from facing two sides among virtual four sides that are set while the die pad is located at its center, and a plurality of inner leads that is formed toward the remaining two sides thereof. <P>SOLUTION: The lead frame has a suspension lead 8. The suspension lead 8 is arranged inside a resin sealing area 17 in the semiconductor device and a part other than a heat radiating fin 4 exposing over the sealing resin in the lead frame. <P>COPYRIGHT: (C)2008,JPO&INPIT</p> |
