| 摘要 |
<p><P>PROBLEM TO BE SOLVED: To provide a prober for increasing through-put by restricting an increase in installation area for the whole probing inspection and an increase in device cost. <P>SOLUTION: The prober provides for inspecting a semiconductor device on a wafer with a tester and includes: a first wafer chuck 16A; a second wafer chuck 16B; a first probe card 24A having a probe, which comes into contact with a wafer held by the first wafer chuck; a second probe card 24B having a probe, which comes into contact with a wafer held by the second wafer chuck; an alignment camera 22; a first movement mechanism, which can move the first wafer chuck to a position under the first probe card and the alignment camera; and a second movement mechanism, which can move the second wafer chuck to a position under the second probe card and the alignment camera. The first and second movement mechanisms move the first and second wafer chucks respectively and independently. <P>COPYRIGHT: (C)2008,JPO&INPIT</p> |
