MULTILAYER PRINTED-WIRING BOARD AND MANUFACTURING METHOD THEREOF

摘要

PROBLEM TO BE SOLVED: To provide a highly productive multilayer printed-wiring board, and to provide a manufacturing method of the multilayer printed-wiring board capable of manufacturing a multilayer printed-wiring board having improved connection reliability with a simple process. SOLUTION: The multilayer printed-wiring board has: a base material; a first conductive layer provided on one surface of the base material; and a second conductive layer provided on the other surface of the base material. A first land section that is one portion of the first conductive layer is electrically connected to a second land section that is one portion of the second conductive layer with a cured product of conductive paste filled into a blind via hole with the second land section as a bottom surface. The multilayer printed-wiring board has a plurality of blind via holes in the first and second land sections. COPYRIGHT: (C)2008,JPO&INPIT