发明名称 HALF CUTTING DEVICE, HALF CUTTING METHOD AND TAPE PRINTER
摘要 PROBLEM TO BE SOLVED: To provide a half cutting device which can stably perform half cutting by a simple device configuration. SOLUTION: The half cutting device 58 which half cuts a pressure sensitive adhesive tape T comprised of both a body tape T1 with an adhesive applied to the rear face and a release tape T2 pasted to the body tape T1 via the adhesive comprises an electric heating cutting means 67 which thermally melts and cuts a cutting object tape as either one of the body tape T1 and the release tape T2 along a half cutting line, a holding means 68 which holds the electric heating cutting means 67 to compose the half cutting line, and a cutting action means which presses the electric heating cutting means 67 electrified through the holding means 68 to the cutting object tape. COPYRIGHT: (C)2008,JPO&INPIT
申请公布号 JP2008179003(A) 申请公布日期 2008.08.07
申请号 JP20070012694 申请日期 2007.01.23
申请人 SEIKO EPSON CORP 发明人 INABA MASASHI
分类号 B41J11/70 主分类号 B41J11/70
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