| 摘要 |
A method for manufacturing a microelectromechanical system package is provided. A plurality of cavities is first formed on the upper and lower surfaces of a silicon wafer. Next, the lower surface of the silicon wafer is bonded to the microelectromechanical system wafer in such a manner that the active areas of the chips on the microelectromechanical system wafer are received in the cavities on the lower surface of the silicon wafer, respectively. Finally, the structure assembly of the two wafers is singulated along the scribe streets to form individual microelectromechanical system chips whose active areas are covered by the cavities. These microelectromechanical system chips together with other components can be mounted to chip carriers to form microelectromechanical system packages.
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