| 摘要 |
PROBLEM TO BE SOLVED: To provide a build-up substrate capable of detecting the coincidence precision of an inner-layer land and a via accurately and precisely without any erroneous determination, to provide a manufacturing method of the build-up substrate, and to provide an inspection method. SOLUTION: The build-up substrate is composed of the inner-layer land and the via formed at the upper portion of the inner-layer land, where the inner-layer land has an inspection coupon in which a part opened by the via has been eliminated. By this configuration, the outer periphery of the via is determined by the boundary of the presence or absence of a layer for composing the inner-layer land, and only a part sandwiched by the outer periphery of the inner-layer land and that of the via is projected darkly in the X-ray image, thus determining the outer periphery of the via according to a difference in clear shading. COPYRIGHT: (C)2008,JPO&INPIT |
