| 摘要 |
PROBLEM TO BE SOLVED: To provide a thermocompression bonding device and a thermocompression bonding method, along with a repair device, of which a glass substrate is not fractured at thermocompression bonding. SOLUTION: The thermocompression bonding device includes a first glass substrate, a second glass substrate, and a sealing member which seals the opposite peripheral parts of the first and second glass substrates. A thermocompression bonding unit for thermocompression-bonding a member is provided to the member, which is thermocompression bonded, positioned at a protrusion of a glass structure of which one side of the first glass substrate protrudes to form the protruding part. The thermocompression bonding device includes a heating unit which heats the sealing member adjacent to the member at the same time the member is thermocompression-bonded, or in advance. COPYRIGHT: (C)2008,JPO&INPIT
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