| 摘要 |
An exemplary sputtering apparatus is provided. The sputtering apparatus includes a chamber, a workpiece carrier and at least a sputtering cathode. The chamber defines a sputtering cavity. Disposed in the sputtering cavity, the workpiece carrier includes a rotating disk and a plurality of rotating rods extending through and slidably engaged with the rotating disk. The rotating rods are configured for mounting multiple workpieces thereon and rotatable around a central axis of the rotating disk. The rotating rods are also rotatable around respective central axes of themselves. Disposed in the sputtering cavity, the sputtering cathode carries a target and is configured for sputtering the target material onto the workpieces on the rotating rods.
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