| 摘要 |
The present invention relates to a package and a method for making the same. The package includes a substrate, a semiconductor element, and an underfill. The semiconductor element has a first surface. A plurality of bumps and at least one ring structure are disposed on the first surface, in which the bumps are outside the ring structure. The semiconductor element is disposed on the substrate through the bumps and the ring structure. The ring structure of the semiconductor element and the substrate define a closed space. The bumps electrically connect the substrate and the semiconductor element. The underfill is filled between the substrate and the semiconductor element, covering the bumps and out of the ring structure. Since the package of the present invention has the closed space, the package is not only applicable for a common flip chip package, but also for micro electro-mechanical systems (MEMS) having movable elements. In addition, a wire bonding process is not needed for the package, such that the packaging steps can be simplified so as to reduce the packaging time and the production cost.
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