发明名称 HEATING APPARATUS AND HEATING METHOD
摘要 A disclosed heating apparatus includes a heating chamber configured to heat a substrate placed in the heating chamber with a heat plate opposing the substrate; a gas stream forming portion that creates a gas stream along a top surface of the substrate in the heating chamber; and a pair of first plate members respectively located between an inner side wall of the heating chamber and a first substrate edge opposing the inner side wall, and between another inner side wall of the heating chamber and a second substrate edge opposing the other inner side wall.
申请公布号 US2008185370(A1) 申请公布日期 2008.08.07
申请号 US20080022489 申请日期 2008.01.30
申请人 TOKYO ELECTRON LIMITED 发明人 FUKUOKA TETSUO;KITANO TAKAHIRO;TERADA KAZUO
分类号 G03F7/40;F27D99/00;H01L21/027 主分类号 G03F7/40
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