发明名称 |
MULTILAYER BODY, METHOD FOR PRODUCING SUBSTRATE, SUBSTRATE AND SEMICONDUCTOR DEVICE |
摘要 |
Disclosed is a multilayer body (10) having a resin layer (2) internally containing a core portion (1) which is composed of a fiber base, and a metal layer (3) joined to one side of the resin layer. The fiber base has a thickness of not more than 25 µm, and the metal layer has an opening (31) corresponding to a via hole to be formed in the resin layer. Also disclosed is a method for producing a substrate, which comprises a step for forming a via hole (23) in the resin layer by irradiating the multilayer body with a laser (9), and a step for removing the metal layer from the multilayer body after formation of the via hole. Further disclosed is a substrate (100) produced by such a method. Still further disclosed is a semiconductor device (12) which is obtained by mounting a semiconductor element (121) on the substrate. |
申请公布号 |
WO2008093579(A1) |
申请公布日期 |
2008.08.07 |
申请号 |
WO2008JP50889 |
申请日期 |
2008.01.23 |
申请人 |
SUMITOMO BAKELITE COMPANY LIMITED;MORIMOTO, JUNPEI;KANEDA, KENICHI |
发明人 |
MORIMOTO, JUNPEI;KANEDA, KENICHI |
分类号 |
H05K3/46;B32B15/08;C08J5/24;H01L23/12;H01L23/14;H05K3/00 |
主分类号 |
H05K3/46 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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