| 摘要 |
<p><P>PROBLEM TO BE SOLVED: To accurately bend a bend part with fixed hardness of a rigid printed wiring board for which a measure against heat is taken. <P>SOLUTION: In the method for bending the bend type rigid printed wiring board for which the bend part composed by partially thinning hard laminate plates 1 and 2 is formed, through-holes are formed at four corners of each of the laminate plates 1 and 2 positioned on both sides across the bend part, an insulation panel 5 in a frame body shape provided with bosses 6 to be inserted into the through-holes on the front and back and provided with a large hole 7 at a center part for releasing soldered terminals is attached by inserting the bosses 6 on the front to the through-holes of one laminate plate 1, and the other laminate plate 2 is bent from the bend part, piled up on the insulation panel 5 and attached by inserting the bosses 6 on the back into the through-holes. <P>COPYRIGHT: (C)2008,JPO&INPIT</p> |
