| 摘要 |
<p><P>PROBLEM TO BE SOLVED: To provide a semiconductor device that suppresses heat load to an electronic part or a printed wiring board or the like in reflow-mounting the electronic part and easily evaluates the temperature of a solder paste so as to set the optimal temperature profile for sufficient heating of solder bonding. <P>SOLUTION: In the resin sealed semiconductor device using a lead frame, a temperature indicating material 7 that is discolored at a specified temperature is coated to the surface of an outer lead 4b located outside the sealing resin 6 of the lead 4. <P>COPYRIGHT: (C)2008,JPO&INPIT</p> |
