SUBSTRATE TREATING EQUIPMENT

摘要

PROBLEM TO BE SOLVED: To prevent a substrate from being polluted with dust and a particle present in a suction passage in treating equipment using the method of holding the substrate by suction.

SOLUTION: Substrate treating equipment is constituted by providing a suction port 14 for sucking a wafer in a spin chuck 10 for holding the wafer W which is a substrate to be treated in such a manner that the wafer can be rotated and connecting a vacuum pump 20 to the suction port. In the substrate treating equipment, a dirt prevention means 40 for preventing the dirt of a suction passage 15a which connects the suction port in the spin chuck and the vacuum pump is provided. The dirt prevention means is formed of a filter member 41 arranged on a suction port side in the suction passage.

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