| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide a package structure, along with a semiconductor device, capable of preventing disconnection of a surface layer wiring, relating to a manufacturing process. <P>SOLUTION: There are provided a substrate 2 which is enclosed with a first side 12A, bored before a mounting process, and a second side 13, cut after the mounting process, and comprises a plurality of wiring layers, a sealing member 10 formed on one surface of the substrate 2, and a surface layer wiring 4 formed in the wiring layer closest to the sealing member 10. The surface wiring 4 is formed in a wiring implementing permission region comprising a sealing member formation region 300, in which the sealing member 10 is formed, and a region between the first side 12A and a part 10A of the outside edge of the sealing member formation region 300, facing the first side 12A. <P>COPYRIGHT: (C)2008,JPO&INPIT |
