| 摘要 |
<P>PROBLEM TO BE SOLVED: To disclose a stacked package and its manufacturing method. <P>SOLUTION: A stacked package includes a printed circuit board, a plurality of semiconductor chips that is successively laminated on the printed circuit board, a plug for electrically connecting the printed circuit board to each of the semiconductor chips, and a controller that is built in any one of the semiconductor chips and electrically connected to the plug. Thus, the controller is incorporate in the semiconductor chip through separate steps, so the phenomenon that mechanical impacts are applied on the semiconductor chips during a controller bonding step can be fundamentally prevented. Moreover, the application of the mechanical impacts on the controller during a protection member forming step can be suppressed. <P>COPYRIGHT: (C)2008,JPO&INPIT |
