| 摘要 |
PROBLEM TO BE SOLVED: To provide a polishing device and a polishing method capable of accurately chamfering a workpiece. SOLUTION: The long workpiece 51 is attached on a long contact surface 32 parallel to a polishing surface 15 in the polishing device 11. A fixed member 23 is supported on a spherical receiving section 35 in a position-changeable state. The workpiece 51 can be surely brought into contact with the polishing surface 15 of a base 12 on the basis of the position change of the fixed member 23. Thus, chamfering of the workpiece 51 can be accurately performed by moving a moving block 16 parallel to the polishing surface 15. Further, generation of microcracks and chippings is considerably restrained on the workpiece 51. The workpiece 51 moves on the polishing surface 15 in the one-way direction only, so that generating probability of microcracks and chippings can be substantially reduced on the workpiece 51. COPYRIGHT: (C)2008,JPO&INPIT |
