发明名称 Post-dry etching cleaning liquid composition and process for fabricating semiconductor device
摘要 A post-dry etching cleaning liquid composition for cleaning a substrate after dry etching is provided, the cleaning liquid composition containing at least one type of fluorine compound, glyoxylic acid, at least one type of organic acid salt, and water. With regard to the fluorine compound, ammonium fluoride may be used. With regard to the organic acid salt, at least one of ammonium oxalate, ammonium tartarate, ammonium citrate, and ammonium acetate may be used.
申请公布号 US2008188085(A1) 申请公布日期 2008.08.07
申请号 US20080075578 申请日期 2008.03.11
申请人 MURAMATSU MASAFUMI;ASADA KAZUMI;HAGINO YUKINO;OKUYAMA ATSUSHI;NAKAJIMA TAKAHITO;TAKASE KAZUHIKO;UOZUMI YOSHIHIRO;MATSUMURA TSUYOSHI;OHWADA TAKUO;ISHIKAWA NORIO 发明人 MURAMATSU MASAFUMI;ASADA KAZUMI;HAGINO YUKINO;OKUYAMA ATSUSHI;NAKAJIMA TAKAHITO;TAKASE KAZUHIKO;UOZUMI YOSHIHIRO;MATSUMURA TSUYOSHI;OHWADA TAKUO;ISHIKAWA NORIO
分类号 C23G1/00;H01L21/3065;C11D3/02;C11D3/20;C11D3/24;C11D7/08;C11D7/10;C11D7/26;C11D7/32;C11D11/00;C23G1/24;H01L21/02;H01L21/304;H01L21/3205;H01L21/336;H01L21/461;H01L21/768;H01L23/52;H01L23/522;H01L29/78 主分类号 C23G1/00
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