发明名称 |
LED PACKAGE WITH METAL PCB |
摘要 |
<p>An LED package having a metal PCB is provided to enhance compatibility with a conventional electronic device or illuminating device by using leads connected to an external electrode. A stacked structure includes a first metal layer(16), a second metal layer(12), and an electrical insulating layer(14) formed between the first metal layer and the second metal layer. The first metal layer includes a metal PCB(10) having a plurality of electrode patterns(162a,162b) positioned on an upper surface of the electrical insulating layer, an LED chip(2) mounted on the first metal layer of the metal PCB, and a plurality of leads(164a,164b) extended from the electrode patterns of the first metal layer to an outside of an upper surface of the electrical insulating layer.</p> |
申请公布号 |
KR100850666(B1) |
申请公布日期 |
2008.08.07 |
申请号 |
KR20070032018 |
申请日期 |
2007.03.30 |
申请人 |
SEOUL SEMICONDUCTOR CO., LTD. |
发明人 |
KANG, SUK JIN;KIM, DO HYUNG |
分类号 |
H01L33/54;H01L33/60;H01L33/62;H01L33/64 |
主分类号 |
H01L33/54 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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