| 摘要 |
<p><P>PROBLEM TO BE SOLVED: To provide a joined article which is formed by unitarily joining two or more members to be joined by means of a bonding material layer formed from a bonding material composition, can suppress the deformation of members to be joined due to thermal distortion with the bonding material layer, hardly causes the rupture of the bonding material layer due to stress, and has excellent thermal shock resistance. <P>SOLUTION: The joined article is formed by unitarily joining two or more members to be joined by means of a bonding material layer 9 formed from a bonding material composition. The bonding material composition contains flat particles, non-flat particles, and an inorganic adhesive as main components, and the bonding material layer 9 has a Young's modulus of 3 GPa or more. <P>COPYRIGHT: (C)2008,JPO&INPIT</p> |
