| 摘要 |
PROBLEM TO BE SOLVED: To provide an epoxy resin composition for semiconductor packaging, used for manufacturing a semiconductor device restrained in the generation of warpage and showing excellent reliability. SOLUTION: The epoxy resin composition for packaging a semiconductor contains the following components (A)-(C): (A) an epoxy resin; (B) a phenolic resin; and (C) at least one selected from the group consisting of molybdenum disulfide, tungsten disulfide and hexagonal system boron nitride. COPYRIGHT: (C)2008,JPO&INPIT
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