发明名称 APPLICATOR OF POWDERED MOLD RELEASE AND APPLYING METHOD OF POWDERED MOLD RELEASE
摘要 PROBLEM TO BE SOLVED: To provide an applicator 1 of powdered mold release and an applying method for improving quality and productivity by controlling a gap which is generated in a contact surface 4 of a mold 3(2). SOLUTION: The applicator 1 of powdered releasing agent has a cavity 21 inside thereof; a movable mold 3 and a fixed mold 2, to which a molten material is poured while the molds are brought into contact for solidifying the molten material inside; a discharging device 44 of the powdered mold release which discharges the powdered mold release to the movable mold 3 and the fixed mold 2; a supplying nest 42 which supplies the powdered mold release discharged from the discharging device 44 to the cavity 21; a suction nest 45 which is provided at least one of the movable mold 3 or the fixed mold 2 for discharging outside the surplus powdered mold release from the cavity 21; and cooling holes 31 (23 and 34) for cooling the movable mold 3 and the fixed mold 2 so as to prevent expansion of at least one of the molds 3 and 2. The powdered mold release is applied by preventing expansion of at least one of the molds 3 and 2. COPYRIGHT: (C)2008,JPO&INPIT
申请公布号 JP2008179105(A) 申请公布日期 2008.08.07
申请号 JP20070015890 申请日期 2007.01.26
申请人 AISIN SEIKI CO LTD 发明人 INOUE KAZUYA
分类号 B29C33/58;B22C9/06;B22C23/02;B22D17/20;B22D17/22;B29C45/73;B29C45/78 主分类号 B29C33/58
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