The process involves materially bonding a part made of tungsten or tungsten alloy to a part made of copper or copper alloy, where the tungsten part is structured around its joining surface prior to the joining process in order to create a larger surface area. The structured area can have indentations and/or protrusions produced through blasting with an electron beam or through mechanical machining. An independent claim is included for a composite component with tungsten and copper parts joined together with the tungsten part having a structured surface in its joining area.
申请公布号
DE502006000976(D1)
申请公布日期
2008.08.07
申请号
DE20065000976T
申请日期
2006.08.25
申请人
PLANSEE SE
发明人
SCHEDLER, BERTRAM;HUBER, THOMAS;FRIEDRICH, THOMAS;SCHEIBER, KARLHEINZ;SCHEDLE, DIETMAR;ZABERNIG, ANTON DR.-ING.;FRIEDLE, HANS-DIETER;MAIR, SANDRA;WOERLE, NADINE;TABERNIG, BERNHARD