| 摘要 |
<P>PROBLEM TO BE SOLVED: To prevent image deterioration caused by a variation in interval between an imaging device and an imaging lens caused by the warpage of a circuit board resulting from the generated heat of the imaging device, an IC element, etc. <P>SOLUTION: The circuit board 36 is held by being abutted against the back of a substrate holding plate 113 on the opposite side from the imaging lens 38 so that the light receiving surface of the imaging device 34 faces the imaging lens 38, and the back of the imaging device 34 is abutted against a first element support member 122 and a second element support member 124. <P>COPYRIGHT: (C)2008,JPO&INPIT |
