| 摘要 |
<p><P>PROBLEM TO BE SOLVED: To provide a smooth lightweight board having a low density but having nearly uniform resin filling ratio in the direction of thickness, a high resin filling ratio also at the center region to attain excellent bending behavior, free from abrupt stress drop even if being bent beyond a bending level exhibiting maximum bending stress and having excellent surface smoothness and light weight. <P>SOLUTION: The smooth lightweight board material is composed mainly of a nonwoven fiber fabric containing 80-100 mass% wet-heat bondable fiber, has a thickness of 0.5-6.0 mm and an apparent density of 0.2-0.5 g/cm<SP>3</SP>and satisfies the requirements that (1) the filling ratio of the fiber resin in the cross-section is 40-80%, (2) the average center-line roughness is≤100μm on at least one surface, and (3) the maximum bending stress is≥1.0 Pa at least in one direction and the bending stress at the bending level corresponding to 1.5 times the maximum bending stress is≥1/3 of the maximum bending stress. <P>COPYRIGHT: (C)2008,JPO&INPIT</p> |
