| 摘要 |
A layered structure produced by metallizing a substrate including: (a) providing a transfer film including film layer and metal layer bonded together by a cured breakaway layer; (b) providing a substrate; (c) applying electron beam curable transfer adhesive to a portion of the substrate; (d) securing the transfer film to the substrate, where the transfer adhesive is between the metal layer and substrate, forming an intermediate product; (e) passing the intermediate product through an electron beam curing apparatus to cure the transfer adhesive; and (f) removing the transfer film. In the metallized product, the cured breakaway coating is bonded only to the metal. The cured breakaway layer preferably has a cured elongation at break, in tension, of less than about 20%. Precise metallized edges are produced, e.g., edge variation of about ±0.010 in., or better. The process can be utilized with total or selective metal transfer.
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