发明名称 Buried Stress Isolation for High-Performance CMOS Technology
摘要 A field effect transistor (FET) comprises a substrate; a buried oxide (BOX) layer over the substrate; a current channel region over the BOX layer; source/drain regions adjacent to the current channel region; a buried high-stress film in the BOX layer and regions of the substrate, wherein the high-stress film comprises any of a compressive film and a tensile film; an insulating layer covering the buried high-stress film; and a gate electrode over the current channel region, wherein the high-stress film is adapted to create mechanical stress in the current channel region, wherein the high-stress film is adapted to stretch the current channel region in order to create the mechanical stress in the current channel region; wherein the mechanical stress comprises any of compressive stress and tensile stress, and wherein the mechanical stress caused by the high-stress film causes an increased charge carrier mobility in the current channel region.
申请公布号 US2008185658(A1) 申请公布日期 2008.08.07
申请号 US20080099195 申请日期 2008.04.08
申请人 INTERNATIONAL BUSINESS MACHINES CORPORATION 发明人 IEONG MEIKEI;REN ZHIBIN;YIN HAIZHOU
分类号 H01L27/08;H01L21/8238 主分类号 H01L27/08
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