发明名称 |
METHOD FOR MANUFACTURING MODULE LOADING FUNCTION ELEMENT |
摘要 |
<P>PROBLEM TO BE SOLVED: To provide a method for manufacturing a module loading a function element of the hollow exposing structure that may be resin-sealed in higher accuracy without use of an expensive dispenser. <P>SOLUTION: The method for manufacturing a module loading a function element includes: a resin printing step for forming a protruded sealing resin part 6a at an area near a hole part 2 by applying a sealing resin 6 for printing on a package forming member 1 of a first forming part 10; an integrating step for integrating the first forming part 10 and a second forming part 20 in the condition that a hole part 2 of the package forming member 1 and a function part 13 of the function element 12 are provided opposed to with each other by arranging a pier part 17 for damming the sealing resin 6 between the package forming member 1 of the first forming part 10 and a wiring substrate 11 of the second forming part 20; a resin hardening step for hardening the sealing resin 6a provided in a sealing object space 18 between the package forming member 1 of the first forming part 10 and the wiring substrate 11 of the second forming part; and a removing step for removing the pier part 17. <P>COPYRIGHT: (C)2008,JPO&INPIT |
申请公布号 |
JP2008182026(A) |
申请公布日期 |
2008.08.07 |
申请号 |
JP20070013815 |
申请日期 |
2007.01.24 |
申请人 |
SONY CHEMICAL & INFORMATION DEVICE CORP |
发明人 |
HOTTA YOSHITO;FUJII YOSHITO;ASADA TAKAHIRO |
分类号 |
H01L31/02;H01L33/62 |
主分类号 |
H01L31/02 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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