| 摘要 |
<p><P>PROBLEM TO BE SOLVED: To provide an electronic component-embedded board, capable of reducing a thickness and a wiring length of a printed-wiring board housing electronic components, especially thick semiconductor elements and capacitors, and miniaturizing an electrode pitch caused by the miniaturization of the electronic components. <P>SOLUTION: The electronic-component embedded board 100 comprises an insulating layer 4; a first wiring layer 1 with its one surface exposed in the boundary of the insulating layer 4 and the other surface embedded in the insulating layer; a second wiring layer 2 contacting with the boundary of the insulating layer and not buried in the insulating layer; and the electronic component connected to the first wiring layer and buried in the insulating layer. <P>COPYRIGHT: (C)2008,JPO&INPIT</p> |
