| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide a semiconductor device which is capable of non-contact communication without forming a resonance circuit on an IC and simplifies structures of a wiring pattern and an antenna formed on the IC and is easy to manufacture. <P>SOLUTION: The semiconductor device includes a conductive film provided on one face of a substrate and functioning as the antenna, an IC chip, and a first conductive film and a second conductive film provided independently of each other so as to be electrically connected to the IC chip. The IC chip is provided on the other face of the substrate so that the first conductive film and the second conductive film form a capacity together with the conductive film functioning as the antenna through the substrate, and the IC chip transmits and receives data to and from the outside through the conductive film functioning as the antenna. <P>COPYRIGHT: (C)2008,JPO&INPIT |
