| 摘要 |
PROBLEM TO BE SOLVED: To provide a manufacturing method of a substrate, along with a manufacturing method of a semiconductor package that uses the same substrate, capable of effectively utilizing a terminal electrode that is arranged in the mounting region of a semiconductor element. SOLUTION: In the manufacturing method of a substrate equipped with terminal electrodes 11 that are independent of each other, a lead frame base material 2 comprising through holes 1 independent of each other are formed. The terminal electrode is formed by filling the through hole with a conductive paste 7; a lead-out wiring 12, which is led out of the terminal electrode formed in the mounting region of the semiconductor element to a non-mounting region of the semiconductor element, is formed. After that, a semiconductor element 13 is mounted and wire-bonding work is performed, which is sealed with a mold resin 15. COPYRIGHT: (C)2008,JPO&INPIT
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