The present invention provides a molding system for molding a substrate with a molding material. The present invention further provides a process for molding a substrate with a molding material.
申请公布号
WO2008094124(A1)
申请公布日期
2008.08.07
申请号
WO2007SG00032
申请日期
2007.02.01
申请人
ADVANCED SYSTEMS AUTOMATION LTD;CHEN, HONGJIAN;WANG, ZIYAO;LIM, ENG SOON
