发明名称 Memory device and method of fabricating the same
摘要 A memory device may include a substrate, a bit line, at least a first lower word line, at least a first trap site, a pad electrode, at least a first cantilever electrode, and/or at least a first upper word line. The bit line may be formed on the substrate in a first direction. The first lower word line and the first trap site may be insulated from the bit line and formed in a second direction crossing the bit line. The pad electrode may be insulated at sidewalls of the first lower word line and the first trap site and connected to the bit line. The first cantilever electrode may be formed in the first direction, connected to the pad electrode, floated on the first trap site with at least a first lower vacant space, and/or configured to be bent in a third direction. The first upper word line may be formed on the first cantilever electrode in the second direction with at least a first upper vacant space.
申请公布号 US2008185668(A1) 申请公布日期 2008.08.07
申请号 US20080007819 申请日期 2008.01.16
申请人 SAMSUNG ELECTRONICS CO., LTD. 发明人 KIM MIN-SANG;LEE SUNG-YOUNG;KIM SUNG-MIN;YUN EUN-JUNG;KIM DONG-WON;PARK DONG-GUN
分类号 H01L29/84;H01L21/00 主分类号 H01L29/84
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